CSP/BGA Board Inspection Systems

Systems with superior imaging quality and highly accurate detection allow high efficiency
and production of various boards such as Plastic Ball Grid Array(PBGA) boards.

Package Board Final Inspection System (IS-2000)

For detecting foreign materials, discoloration and unfixed resists on metallic areas, IS-2000 provides one-pass inspection on both sides of CSP/BGA rigid substrates with the tact time in 10 sec or less.

	Scanner part
	CSP substrates(Example)

Board Verify Station (IS-2050C) S-2050C automatically enlarges defect images for operator to recheck them on the screen.

PBGA Inspection System (IS-2000S) Incorporating advanced technology, IS-2000S inspects resist and metallic areas on PBGA boards. Large Board Inspection System (IS-4000) Fine cleaners and multiple cameras make IS-4000 inspect 610*610mm large boards at an extremely high speed.